Home
DISCIPLINES

Thermal Analysis

From products like bottles and cans to space age equipment, engineering history is rife with instances of failures due to insufficient understanding and/or accounting of thermal response of structures. Adequate knowledge of temperature distribution in structures, thermal flux and structural response to thermal gradients is critical to successful designs.

Thermal Analysis Resoltutions

Compumod's thermal simulation solutions enable you to model thermal response including all the modes of heat transfer, namely conduction, convection and radiation, which could be affecting the response simultaneously. Radiation view factors, critical for radiated energy flow calculations can be computed internally or imported from third party vendors providing options to our users. Additionally, both material properties and boundary conditions could be varied based on local temperatures, and can be modeled accurately and elegantly within Compumod's products.

The objective of a thermal study is often to understand response and performance of the structure. Based on the modeling needs, chained or coupled analysis can be executed, to study temperature variations and effects on structural behavior, both in terms of the stress response and failure. The multi-physics capabilities that involve thermal response can be extended further to include Joule heating and electromagnetic effects enhancing the value of the simulation solution from Compumod.

Thermal solutions from Compumod offers state of the art technology, options and performance

  • Comprehensive solver capabilities

  • Efficient calculation of radiation view factors

  • Thermal contact to allow heat transfer across bodies

  • FEA and RC-Network based methods for technology choice

Industry Uses

  • Aerospace & Defence: Jet engines, Nozzles, Avionics, Satellites/re-entry vehicles ;

  • Automotive: Exhaust systems, Drivetrain, Thermal effects on seal behavior, Welding, Backlite (Joule heating), Brakes;

  • Consumer Products / Packaging: Bottle hotfilling, Thermal cycling effects on bottles/cans, Appliances;

  • Electronics: Solder, PCB, Silicon wafers;

  • Energy: Solar panels, Sealing performance due to thermal cycling, Pressure vessels.


Related Products

MSC Nastran, MD Nastran, Marc & Mentat, Patran, SimXpert, ZW3D